College of Engineering News

Artist's concept illustration depicting a stack of heterogenous materials similar those used in this project. Illustration by Brian Long

Jul 27, 2023

Going Vertical to Advance a New Realm of High-Precision PICs

3D integration of monolithic and heterogeneous layers allows the Bowers lab to achieve an important milestone.

Alex Mei, 2023 University Award of Distinction recipient

Jul 11, 2023

Above and Beyond

Computer science graduate student honored for dedication to student success.

UC Santa Barbara’s Materials Research Laboratory (MRL) has received its seventh consecutive major grant from the National Science Foundation.

Jun 29, 2023

Seven for Seven

The Materials Research Laboratory received its seventh consecutive major grant from the National Science Foundation.

Computer science assistant professor Misha Sra. Photograph by Lilli McKinney

Jun 29, 2023

An NSF Early CAREER Award for AI researcher Misha Sra

The UCSB computer science assistant professor is using AI to make all kinds of learning accessible.

Evan Pretti, chemical engineering PhD Student

Jun 25, 2023

ChemE PhD Student Evan Pretti Awarded Prestigious MolSSI Fellowship

The software fellowship will allow Evan Pretti to provide insight into neurodegenerative diseases such as Alzheimer's disease.

Receding levels of AI reality: An AI-generated image depicts engineers working on an AI-enabled robot.

Jun 22, 2023

UCSB's GauchoAI Team Takes Second Place in Amazon’s Alexa Prize SimBot Challenge

The team earned $100,000 for the two-year effort, which wrapped up in May.

Robert McMeeking, distinguished professor of mechanical engineering and materials

Jun 22, 2023

A Distinct Honor for a Distinguished Professor

Robert McMeeking receives the 2023 Platinum Medal from the Institute for Materials, Minerals & Mining.

An image of the newly developed transmitter assembly. The small, brownish chip on the left is the electronic integrated circuit (EIC), and the larger, black-and-gold chip on the right is the photonic integrated circuit (PIC). The long structure on the left side of the PIC is the modulator, which converts the electrical signal into an optical one. Light gets coupled into and out of the chip through the fibers on the right side of the PIC. Everything is mounted on a printed circuit board (PCB), with gold wire bonds connecting the chips. Data flows from left to right, where the incoming electrical signal gets amplified by the EIC, converted to an optical signal by the PIC, and sent out via fiber to its destination.